• High power, high luminous efficiency, universal 1-3W.
• High reliability, high thermal conductivity ceramic substrate design.
• Featuring low thermal resistance, the gold wire-free flip-chip packaging shortens the thermal conduction path, resulting in even lower thermal resistance.
•Applied to headlights, daytime running lights, etc.
• Dimensions:2.0*1.6*0.68mm.
Copyright © 2024 Hongli Zhihui Group Co., LTD. Guangzhou Branch. All Rights Reserved.
Guangdong ICP for 13011706. Designed by Wanhu.